77 GHz radar high-frequency board
- Layers
- 18
- Materials
- TSM-DS3 + FR28 prepreg + S1000-2M, hybrid lamination
- Finish
- Immersion gold (ENIG)
- Special process
- Pure PTFE blind/buried-via impedance board, 5 back-drill groups
Industries · Applications
PCB & PCBA for Radar & Sensing
PCB and PCBA for radar and sensing modules that depend on stable RF materials.
Applications
What Radar & Sensing projects need
Radar and sensing designs often use Rogers or PTFE materials, hybrid stack-ups and precise features. Feasibility is confirmed per design. This describes typical requirements and is not a customer reference.
- Rogers and PTFE material options
- Hybrid stack-ups
- Feature accuracy
- Test requirements
Typical applications and certificates
| Positioning | RF / Microwave |
|---|---|
| Typical applications | Industrial / Security / Automotive / Weather Radar |
Related certificates
- ISO 9001:2015133628
- IATF 16949:2016NQA T14016 / IATF 0498905
- AS9100Held by Partner Manufacturing Network
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
Typical radar and sensing modules
Typical requirements from the ShinePCB application capability sheet. Each project is reviewed against its own drawing and specification.
| End product / typical modules | Applicable PCB types | Key processes | Material direction | Engineering focus |
|---|---|---|---|---|
| Industrial / security / automotive / weather radar — RF antenna, front end, signal processing | High-frequency, hybrid high-frequency, HDI | Hybrid lamination; impedance; fine lines; back drilling; layer registration | Rogers, Isola, PTFE | Dk/Df consistency; copper roughness; phase consistency; warpage |
| Satellite communication terminals / ground stations — phased array, RF front end, baseband | High-frequency, hybrid high-frequency, high-speed multilayer | Hybrid lamination; impedance; back drilling; high layer count | mmWave / microwave; low-loss | Low loss; phase consistency; dimensional stability |
| Aviation communication / radar / RF modules | High-frequency, hybrid, high-speed multilayer, rigid-flex | Hybrid lamination; fine lines; impedance; back drilling; edge metallization | Microwave; low-loss; high-reliability FR-4 | RF loss; temperature cycling; vibration; material traceability |
Application descriptions show typical board requirements. They are not customer references, and end-product standards remain the responsibility of the product owner. Aerospace projects are supported through AS9100 certified partner factories; automotive radar is built under IATF 16949.
Selected RF builds
Board constructions from the ShinePCB company presentation — not customer references.
AI server high-speed board
- Layers
- 18
- Material
- Panasonic MEGTRON 8
- Thickness / min hole
- 3.1 mm / 0.15 mm
- Finish
- Full-board electrolytic hard gold
- Challenge
- High layer count, blind vias, thick gold over the full board
12-layer rigid-flex board
- Structure
- 12 layers, 4R + 4F + 4R
- Materials
- ITEQ IT-180 + DuPont AP9141R
- Thickness / min hole
- 1.6 mm / 0.2 mm
- Finish
- Immersion gold (ENIG)
- Application
- High-end industrial connector
Millimeter-wave antenna board
- Layers
- 8
- Material
- Rogers RT5880
- Finish
- Soft gold plating, 3 µm gold
- Special process
- Laser profiling
5G base-station power amplifier board
- Layers
- 4
- Materials
- Rogers RO4350B + FR-4
- Finish
- Immersion gold (ENIG)
- Special process
- Blind vias, step cavity, partially embedded copper block
Builds from the ShinePCB company presentation. They illustrate process scope and are not customer references.
Typical products
Automotive and industrial radar
Presence and motion sensors
Imaging and detection modules
Radar & Sensing FAQs
Which RF material should I use?
It depends on your frequency and loss targets. See high-frequency PCB.
Can RF and FR-4 be combined?
Hybrid stack-ups are reviewed per project.
